This paper discusses a new solution for high performance integration in 3D integrated circuits (ICs). Traditional 2D system-on-ch
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About Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
PowerPoint presentation about 'Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs'. This presentation describes the topic on This paper discusses a new solution for high performance integration in 3D integrated circuits (ICs). Traditional 2D system-on-ch. The key topics included in this slideshow are . Download this presentation absolutely free.