This paper discusses a new approach to IO planning and placement for chip package co-design. The authors introduce the concept of "chip package aware design constraints" and present
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About Constraint-Driven IO Planning and Placement for Chip Package Co-Design
PowerPoint presentation about 'Constraint-Driven IO Planning and Placement for Chip Package Co-Design'. This presentation describes the topic on This paper discusses a new approach to IO planning and placement for chip package co-design. The authors introduce the concept of "chip package aware design constraints" and present. The key topics included in this slideshow are . Download this presentation absolutely free.
